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DS34S132GN Analog Devices Inc./Maxim Integrated
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Manufacturer:
Analog Devices Inc./Maxim Integrated
MFR Product Number:
DS34S132GN
Product Number:
DS34S132GN
MFR Standard Lead Time:
Package/Case:
676-BGA
Detailed Description:
IC TELECOM INTERFACE 676TEPBGA
Datasheet:
Descnt:
Telecom IC TDM-over-Packet (TDMoP) 676-TEPBGA (27x27)
In Stock
7000
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Application Guide:
Product Highlights:
Product Attributes
Manufacturer
Analog Devices Inc./Maxim Integrated
Series
-
Packaging
Tray
Part Status
Obsolete
Function
TDM-over-Packet (TDMoP)
Interface
TDMoP
Number of Circuits
1
Voltage - Supply
1.8V, 3.3V
Current - Supply
-
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
676-BGA
Supplier Device Package
676-TEPBGA (27x27)
Base Product Number
DS34S132
Documents & Media
Datasheets
Mfg Application Notes
Using a DDR3 Memory Module with the DS34S132
How to Make the DS34S132 TDM-over-Packet (TDMoP) IC Interoperable with Other Vendors' TDMoP Devices
Environmental Information
Maxim Integrated RoHS Cert
Maxim Integrated REACH
-
Environmental & Export Classifications
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8542.39.0001
-
Additional Resources
Standard Package
1
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