Compare 
MC33790HEGR2 NXP USA Inc.
Favorite
Compare
Manufacturer:
NXP USA Inc.
MFR Product Number:
MC33790HEGR2
Product Number:
MC33790HEGR2
MFR Standard Lead Time:
Package/Case:
16-SOIC (0.295\, 7.50mm Width)
Detailed Description:
IC DSI INTERFACE 2CH 16SOIC
Datasheet:
Descnt:
In Stock
7000
Contact Name
Business Email
Company Name
Country
Select
Tatget Price
Quantity
Quick RFQ
Application Guide:
Product Highlights:
Product Attributes
Manufacturer
NXP USA Inc.
Series
-
Packaging
Tape & Reel (TR)
Part Status
Obsolete
DigiKey Programmable
Not Verified
Type
Distributed Systems Interface
Input Type
Logic
Output Type
Logic
Current - Supply
1 mA
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
16-SOIC (0.295", 7.50mm Width)
Supplier Device Package
16-SOIC
Base Product Number
MC337
Documents & Media
Environmental Information
NXP USA Inc RoHS Cert
NXP USA Inc REACH
PCN Design/Specification
Copper Wire/Mold Compound Update 31/Oct/2014
Copper Wire Revision A 07/Nov/2014
PCN Packaging
All Dev Label Update 15/Dec/2020
Mult Dev Pkg Seal 15/Dec/2020
-
Environmental & Export Classifications
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
3 (168 Hours)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8542.39.0001
-
Additional Resources
Other Names
935314499518
Standard Package
1,000
