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MC33PF8200A0ES NXP USA Inc.
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Manufacturer:
NXP USA Inc.
MFR Product Number:
MC33PF8200A0ES
Product Number:
MC33PF8200A0ES
MFR Standard Lead Time:
16 Weeks
Package/Case:
56-VFQFN Exposed Pad
Detailed Description:
IC POWER MANAGEMENT
Datasheet:
Descnt:
High Performance i.MX 8, S32x Processor Based PMIC 56-HVQFN (8x8)
In Stock
281
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Application Guide:
Product Highlights:
Product Attributes
Manufacturer
NXP USA Inc.
Series
-
Packaging
Tray
Part Status
Active
Applications
High Performance i.MX 8, S32x Processor Based
Current - Supply
-
Voltage - Supply
2.5V ~ 5.5V
Operating Temperature
-40°C ~ 105°C (TA)
Mounting Type
Surface Mount, Wettable Flank
Package / Case
56-VFQFN Exposed Pad
Supplier Device Package
56-HVQFN (8x8)
Base Product Number
MC33PF8200
Documents & Media
Featured Product
i.MX 8X Multisensory Enablement Kit (MEK)
Power Management ICs for Processors
PCN Design/Specification
PF8100_PF8200 17/Nov/2020
Mult Dev DS Update 26/Feb/2021
PCN Packaging
All Dev Label Update 15/Dec/2020
Mult Dev Pkg Seal 15/Dec/2020
-
Environmental & Export Classifications
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
3 (168 Hours)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8542.39.0001
-
Additional Resources
Other Names
Standard Package
260
