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MC33PF8200DHESR2 NXP USA Inc.
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Manufacturer:
NXP USA Inc.
MFR Product Number:
MC33PF8200DHESR2
Product Number:
MC33PF8200DHESR2
MFR Standard Lead Time:
39 Weeks
Package/Case:
56-VFQFN Exposed Pad
Detailed Description:
POWER MANAGEMENT IC I.MX8 PRE-PR
Datasheet:
Descnt:
High Performance i.MX 8, S32x Processor Based PMIC 56-HVQFN (8x8)
In Stock
7000
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Application Guide:
Product Highlights:
Product Attributes
Manufacturer
NXP USA Inc.
Series
-
Packaging
Tape & Reel (TR)
Part Status
Active
Applications
High Performance i.MX 8, S32x Processor Based
Current - Supply
-
Voltage - Supply
2.5V ~ 5.5V
Operating Temperature
-40°C ~ 105°C (TA)
Mounting Type
Surface Mount, Wettable Flank
Package / Case
56-VFQFN Exposed Pad
Supplier Device Package
56-HVQFN (8x8)
Base Product Number
MC33PF8200
Documents & Media
PCN Packaging
All Dev Label Update 15/Dec/2020
Mult Dev Pkg Seal 15/Dec/2020
-
Environmental & Export Classifications
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
3 (168 Hours)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8542.39.0001
-
Additional Resources
Other Names
Standard Package
4,000
