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MM908E625ACPEKR2 NXP USA Inc.
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Manufacturer:
NXP USA Inc.
MFR Product Number:
MM908E625ACPEKR2
Product Number:
MM908E625ACPEKR2
MFR Standard Lead Time:
Package/Case:
54-SSOP (0.295\, 7.50mm Width) Exposed Pad
Detailed Description:
IC QUAD HALF-BRIDGE 54SOIC
Datasheet:
Descnt:
In Stock
7000
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Application Guide:
Product Highlights:
Product Attributes
Manufacturer
NXP USA Inc.
Series
-
Packaging
Tape & Reel (TR)
Part Status
Obsolete
DigiKey Programmable
Not Verified
Applications
Mirror Control
Core Processor
HC08
Program Memory Type
FLASH (16kB)
Controller Series
908E
RAM Size
512 x 8
Interface
SCI, SPI
Number of I/O
13
Voltage - Supply
8V ~ 18V
Operating Temperature
-40°C ~ 85°C
Grade
Automotive
Mounting Type
Surface Mount
Package / Case
54-SSOP (0.295", 7.50mm Width) Exposed Pad
Supplier Device Package
54-SOIC-EP
Base Product Number
MM908
-
Documents & Media
Datasheets
MM908E625
MM908E625 Fact Sheet
Environmental Information
NXP USA Inc RoHS Cert
NXP USA Inc REACH
PCN Packaging
Automated Packing Implementation 05/Jul/2023
Mult Dev Pkg Seal 15/Dec/2020
HTML Datasheet
MM908E625
MM908E625 Fact Sheet
Environmental & Export Classifications
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
3 (168 Hours)
REACH Status
REACH Unaffected
ECCN
3A991A2
HTSUS
8542.31.0001
-
Additional Resources
Other Names
935314271518
Standard Package
1,000
