Compare R9A06G037GNP#AA0 Renesas Electronics Corporation
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Manufacturer:
Renesas Electronics Corporation
MFR Product Number:
R9A06G037GNP#AA0
Product Number:
R9A06G037GNP-AA0
MFR Standard Lead Time:
24 Weeks
Package/Case:
64-VFQFN Exposed Pad
Detailed Description:
SOC PLC MODEM LSI SMART GRID ASS
Datasheet:
Descnt:
ARM® Cortex®-M3 System On Chip (SOC) IC - 138MHz 64-HVQFN (9x9)
In Stock
500
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Application Guide:
Product Highlights:
Product Attributes
Manufacturer
Renesas Electronics Corporation
Series
-
Packaging
Tray
Part Status
Active
Architecture
DSP, MCU
Core Processor
ARM® Cortex®-M3
Flash Size
-
RAM Size
128KB
Peripherals
PWM
Connectivity
CSI, I2C, UART
Speed
138MHz
Primary Attributes
-
Operating Temperature
-40°C ~ 85°C (TA)
Package / Case
64-VFQFN Exposed Pad
Supplier Device Package
64-HVQFN (9x9)
Number of I/O
16
Documents & Media
Environmental & Export Classifications
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
3 (168 Hours)
REACH Status
REACH Unaffected
ECCN
5A002A REN
HTSUS
8542.31.0001
-
Additional Resources
Other Names
559-R9A06G037GNP#AA0
Standard Package
25
