Compare SC900841JVKR2 NXP USA Inc.
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Manufacturer:
NXP USA Inc.
MFR Product Number:
SC900841JVKR2
Product Number:
SC900841JVKR2
MFR Standard Lead Time:
Package/Case:
338-TFBGA
Detailed Description:
IC POWER MGT 338-MAPBGA
Datasheet:
Descnt:
PC's, PDA's PMIC 338-TFBGA (11x11)
In Stock
7000
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Application Guide:
Product Highlights:
Product Attributes
Manufacturer
NXP USA Inc.
Series
-
Packaging
Tape & Reel (TR)
Part Status
Obsolete
Applications
PC's, PDA's
Current - Supply
-
Voltage - Supply
-
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
338-TFBGA
Supplier Device Package
338-TFBGA (11x11)
Base Product Number
SC900841
Documents & Media
Environmental Information
NXP USA Inc RoHS Cert
NXP USA Inc REACH
PCN Obsolescence/ EOL
Environmental & Export Classifications
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
3 (168 Hours)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8542.39.0001
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Additional Resources
Standard Package
2,000
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